Date & Time
April 29, 2025
May 6, 2025
May 27, 2025
Venue
Austin
Boston
Europe
ACL Digital at TSMC 2025: Shaping the Future of AI and Silicon Engineering
Join ACL Digital at the TSMC 2025 Technology Symposium, where we proudly showcase our cutting-edge semiconductor and embedded systems expertise. Connect with us at the Austin and Boston Technology Workshops and Europe Technology Symposium to explore how we drive AI and silicon technology innovation.
As a trusted partner in next-generation technologies, ACL Digital delivers unparalleled solutions in high-performance computing (HPC), AI/machine learning (AI/ML), technology IP porting, and SERDES IP design and development. Our industry-leading Centers of Excellence (CoEs) empower businesses across key domains, including automotive semiconductors, wireless networking, IoT, and 5G.
Semiconductor Expertise for a Connected World
- TSMC Design Centre Alliance
- RISC-V Centre of Excellence
- ARM Approved Design Partner
- Functional Safety & ISO 26262 Centre of Excellence
Core Strengths
- CPU Subsystems
- Memory Subsystems
- Interface Subsystems
Our competence covers technology IP porting and SERDES IP design and development, both essential for driving semiconductor advancements. Technology IP porting requires high precision to meet or surpass specifications, a challenge we address with deep expertise and meticulous execution. Likewise, SERDES IP design tackles the complexities of modern connectivity, ensuring seamless data transmission and optimal performance amidst evolving industry standards.
ACL Digital at TSMC 2025 Technology Symposium
Schedule a meeting with our team at the TSMC events below.
- Austin Technology Workshop
Tuesday, April 29, 2025 - Boston Technology Workshop
Tuesday, May 6, 2025 - Europe Technology Symposium
Tuesday, May 27, 2025
What You Can Expect
The TSMC 2025 NA Technology Symposium will highlight the following:
- TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
- TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
- TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™
- TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, silicon photonics, and more
- TSMC’s manufacturing excellence, capacity expansion plans, and green manufacturing achievements
- TSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design
Don’t Miss Out on Our Latest Events – Register Today!
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