Date & Time
April-24, 08:30 am
Venue
Santa Clara
Powering AI with Silicon Leadership at TSMC 2024 NA Technology Symposium
ACL Digital, an ALTEN group company, is excited to showcase its advanced semiconductor and embedded systems expertise at the upcoming TSMC 2024 NA Technology Symposium in Santa Clara, Booth #215, and participate in the Austin Technology Workshop and Boston Technology Workshop.
As a trusted partner for next-gen technologies, we provide businesses with extensive high-performance computing (HPC), technology IP porting, SERDES IP design and development, and artificial intelligence/machine learning (AI/ML) solutions. Additionally, service providers can benefit from our industry-leading Centers of Excellence (CoEs) in automotive semiconductors, wireless networking, IoT technology, and 5G.
Unmatched Expertise
- TSMC Design Centre Alliance
- RISC-V Centre of Excellence
- ARM Approved Design Partner
- Functional Safety and ISO 26262 Centre of Excellence
Core Strengths
- CPU Subsystems
- Memory Subsystems
- Interface Subsystems
Our expertise extends to Technology IP Porting and SERDES IP Design and Development. Technology IP porting demands precision to maintain or exceed specifications, a challenge we tackle with extensive experience and meticulous execution. Meanwhile, SERDES IP design navigates complex connectivity advancements, ensuring Silicon’s success amid evolving standards and challenges.
ACL Digital at TSMC 2024 Technology Symposium
Schedule a meeting with our team at the below TSMC events:
North America Technology Symposium
Wednesday, April 2024, Santa Clara
Booth #215
Austin Technology Workshop
Thursday, May 2, 2024
Boston Technology Workshop
Thursday, May 9, 2024
What You Can Expect
The TSMC 2024 NA Technology Symposium will highlight the following:
- TSMC’s industry-leading HPC, smartphone, IoT, and automotive platform solutions
- TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond
- TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more
- TSMC 3DFabric™ advanced packaging technology advancement on InFO, CoWoS®, and TSMC-SoIC®
- TSMC’s manufacturing excellence, capacity expansion plans, and green manufacturing achievements
- TSMC’s Open Innovation Platform® ecosystem to speed up time-to-design
Don’t Miss Out on Our Latest Events – Register Today!